Uç Bilgi İşlem için Optimize Edilmiş Kompakt Fansız Tümleşik Bilgisayarlar
Matrix kompakt entegre fansız yerleşik bilgisayarlar ve IoT ağ geçitleri, uç yapay zeka ve uç bilgi işlem uygulamalarının yanıt verebilirliğini ve dayanıklılığını artırmak için tasarlanmıştır. Matrix serisi, daha hızlı teşhis için bilgi işlem yoğun yüksek çözünürlüklü tıbbi görüntülemeyi hızlandırmak ve güvenli erişim kontrolü için yüz tanıma kapılarını etkinleştirmek için kullanılmıştır. Matrix IoT ağ geçitleri, istiridye çiftliklerinin gereksiz yere kapanmasını önlemek, kamyon filoları için araç arıza sürelerini en aza indirmek ve elektrikli arabaların şarjını optimize etmek amacıyla uzaktan izleme ve kontrol için kullanılır.
Kompakt Matrix tümleşik fansız yerleşik PC'ler, endüstriler genelinde verimlilik, üretkenlik ve güvenlik geliştirmesi sağlar. Performans ve dayanıklılık için tasarlanan kompakt Matrix tümleşik fansız tümleşik bilgisayarlar ve IoT ağ geçitleri, uçta zamanında veri odaklı karar vermeyi mümkün kılmak için performans, kolay entegrasyon ve sağlamlık sunar.
Modeller
MXE-5600 Series
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset
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Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
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Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0
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2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0
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Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Embedded expansion: Mini PCIe, M.2 3042, 2x USIM
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Front accessible I/O and adaptive Function Module v.2 option
MXE-5500 Series
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
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Built-in ADLINK SEMA 3.0 management solution
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6th Gen Intel® Core™ i7/i5/i3 Processors and QM170 chipset
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Single-side I/O with two SATA drive bays for easy drive swapping
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1x DVI-I, 2x DisplayPort, 4x USB 2.0, 4x USB 3.0, 4x GbE ports, 6x COM ports, and 8x isolated DI/O
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Rich Storage Options, 2x 2.5" SATA III (6.0 Gb/s) bay, 1x M.2 2280 slot, 1x CFast socket
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Versatile connection via 2x mPCIe slot and 2 x USIM slot
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Rugged construction delivering fanless -20°C to 60 (70)°C operability (w/industrial SSD)
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Compliant with railway EMC standard (EN50121)
MXE-5400
END OF LIFE
Powerful 4th Generation Intel® Core™ i7 Processor-Based Fanless Embedded Computer
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Equipped with 4th generation Intel® Core™ i7-4700EQ processor
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Intel® Quick Sync Video technology supported with ADLINK MSDK+
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Intel® vPro™ technology for security and manageability (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT™)
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Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
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2x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots (one supporting mSATA SSD)
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DVI-I+2x DisplayPorts, 6x USB 3.0, 4x GbE ports, 8x isolated DI/O
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Rugged design for -20ºC to 60ºC fanless operation (w/industrial SSD
MVP-5200 Series
new
12/13th Generation Intel® Processor-Based Compact Modular Industrial Computers
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12/13th generation Intel® Alder Lake-S socket type processor (LGA 1700)
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Microsoft® Windows® or Linux® Ubuntu operating system option
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Rugged, fanless design for 24/7 operation
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Wide-temp operation from -20°C to 60°C
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Scalable with ADLINK AFM (Adaptive Function Module) slot, enabling fast application-specific access
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Front accessible I/O ports, wall mounting supported
MVP-5100-MXM Series
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
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9th Gen Intel® Core™ i7/i5/i3 LGA processor
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Dual SODIMMs sockets for up to 32GB DDR4
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Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
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3x USB 3.1 Gen 1, 3x USB 2.0
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Rich storage options: 2x 2.5" SATA, M.2 2280
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Front accessible I/O and adaptive Function Module 2.0 options
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Embedded slots for Mini PCIe, M.2 3042, 2x USIM
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World leading embedded GP/GPU computing options built-in
MVP-5100 Series
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
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9th Gen Intel® Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
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Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
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Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/ TPM2.0
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2x USB3.1 Gen2 + 1x USB3.1 Gen1 + 3x USB2.0
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Rich storage:2x 2.5" SATA, CFast, M.2 2280
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Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
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Front accessible I/O and adaptive Function Module v.2 option
MVP-5000 Series
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
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Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
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6th Gen Intel® Core™ i7/i5/i3 processors and H110 chipset
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Support for 2x independent displays with 1x VGA, 1x DVI, and 2x DisplayPort
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3x Intel® GbE ports with teaming function
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2x software-programmable RS-232/422/485 + 2x RS-232 ports
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Front-mounted I/O for simplified installation and maintenance
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Extremely cost-effective, high performance fanless system
MXE-1500 Series
Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
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Intel® Celeron® QC N3160/DC N3060 SoC processor
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DDR3L 2x SODIMM up to 8GB
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3x independent displays: DP, VGA (Optional LVDS or DP)
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Built-in ADLINK SEMA management solution
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3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO
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Optional: extra 2x RS-232/422/485, TPM2.0, amplifier
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2x USB 3.0, 5x USB 2.0, 1x 2.5" SATA, CFast, Mini PCIe, I2C
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Last generation to support Windows 7 OS
MXE-1400 Series
Intel® Atom™ E3845 Processor-Based Fanless Embedded Computer
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Quad-Core Intel® Atom™ E3845 processors
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Single side I/O with easy access SATA drive bay
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Compact 210 (W) x 170 (D) x 70 (H) mm housing
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Built-in ADLINK SEMA management solution
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Rugged construction delivering fanless -40°C to 70°C operability (w/industrial SODIMM & SSD) *
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DVI-I+DisplayPort, 6x USB 2.0, 1x USB 3.0, 3x GbE, 6x COM ports, 16x isolated DI/O, 1x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots
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Ignition power input (with MXE-1401V)
MXE-210 Series
Intel Atom® Processor E3900 Family-Based Ultra Compact Embedded Platform
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Equipped with Intel Atom® x7-E3950/x5-E3930 processors
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Compact fanless design: 140(W) x 110(D) x 58(H) mm
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1x DisplayPort, 2x USB 2.0, 2x USB 3.0, 2x GbE ports, 2x COM ports (RS-232/422/485)
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2x mPCIe slots, 1x USIM slot, 1 x mSATA, 1x Micro SD slot
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1 x 2.5 " SATA SSD by storage kit or isolated 8x DI/ 8x DO (Optional)
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eSIM support(by project) (Optional)
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Built-in ADLINK SEMA management solution