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SMARC form faktörü, hem ARM hem de x86 tasarımlarını gerçekten destekleyebilen tek modül üzerinde bilgisayar form faktörüdür. Yüksek hızlı MXM3 konektöründeki 314 pimli SMARC, hem tipik x86 arayüzlerini hem de tipik ARM tipi düÅŸük seviyeli sinyalleri tamamen kapsayabilir. ARM SoC'leri kullanmak, tablet bilgisayarlar ve akıllı telefonlar gibi tanıdık cihazların ürün ekosisteminden yararlanma olasılığını açar.

 

Tablet odaklı x86 cihazları ve diÄŸer RISC CPU'ları gibi alternatif düÅŸük güçlü SoC'ler ve CPU'lar da kullanılabilir.

Modül güç zarfı tipik olarak 6 W'ın altındadır ve form faktörü, aşırı çevre koÅŸullarına dayanabilen tasarımları zorunlu kılan uygulamalar için idealdir.

Modeller

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LEC-MTK-I1200

SMARC Short Size Module with MediaTek Genio 1200 Platform

  • SMARC specification 2.1.1 compliant

  • MediaTek Genio 1200 Platform

  • Support for up to 3 cameras

  • Up to 8GB LPDDR4X, up to 256GB UFS

  • Dual GbE, 2x PCIe Gen3 lanes, USB 3.0

  • Real-time I/O (GPIO, UART, I2C, SPI)

  • -40°C to 85°C rugged operating temperature (optional)

  • 10-year product availability

LEC-RB5

SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC

  • SMARC specification 2.1.1 compliant

  • Qualcomm® QRB5165 octa-core SoC

  • Support for up to 6 cameras

  • Up to 8GB LPDDR4, up to 256GB UFS (optional)

  • Dual GbE, 4x PCIe Gen3 lanes, USB 3.1

  • Real-time I/O (GPIO, UART, I2C, SPI)

  • Rugged operating temperature (optional): -20°C to +85°C

  • 10 year product availability

LEC-EL

SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors

  • SMARC revision 2.1.1 compliant

  • Up to 8GB LPDDR4, in-band ECC

  • Dual 2.5GbE

  • PCIe Gen3 lanes, USB 3.2 10Gbps

  • Real-time I/O (GPIO, UART, I2C)

  • Rugged operating temperature (optional): -40°C to +85°C

  • 10 year product availability

LEC-IMX8MP

SMARC Short Size Module with NXP i.MX 8M Plus

  • NXP i.MX 8M Plus with Quad Cortex-A53

  • Optional in-SoC 2.3 TOPS NPU / Wi-Fi / BT

  • SMARC revision 2.1 compliant

  • LVDS, DSI, HDMI graphic output interfaces

  • Dual CAN bus / USB 2.0 / USB 3.0 interfaces

  • Dual GbE ports (one TSN capable)

  • I2S audio codec interface

  • Rugged operating temperature (optional): -40°C to +85°C

LEC-IMX8MM

SMARC Short Size Module with NXP i.MX 8M Mini SoC

  • NXP i.MX 8M Mini with Dual/Quad Arm Cortex-A53

  • SMARC revision 2.1 compliant

  • LVDS, DSI graphic output interfaces

  • CAN bus / USB 2.0 interfaces

  • Dual GbE ports

  • I²S audio codec interface

  • Rugged operating temperature (optional): -40°C to 85°C

  • 10 year product availability

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LEC-IMX8M

SMARC Short Size Module with NXP i.MX 8M

  • Quad Arm® Cortex®-A53 and Cortex-M4

  • Cryptographic co-processor for end-to-end IOT security

  • Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS

  • Two MIPI-CSI-2 camera inputs

  • 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG

  • Standard or rugged support: 0°C to 60°C or -40°C to 85°C

  • 15 year product availability

LEC-PX30

SMARC Short Size Module with Rockchip PX30 Quad-Core Arm Cortex A35

  • Rockchip PX30 with Quad-core Arm Cortex-A35

  • Cryptography Extensions for end-to-end IoT security

  • 3D Graphics over MIPI DSI 4 lanes or LVDS 24-bit

  • Camera MIPI CSI 4 lanes

  • Optional Rugged operating temperature support: -20°C to 85°C

  • 10 year product availability

LEC-iMX6R2

SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9

  • 8th Gen quad/dual-core Intel® Core™ Processors

  • Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz

  • Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays

  • Up to eight PCIe lanes, GbE

  • NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor

  • Integrated 2D/3D graphics processors, 3D 1080p video processing, power management

  • Onboard DDR3L-1600 system memory from 512 MB to 2 GB

  • Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s

  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

  • 15 year product availability

LEC-AL

SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)

  • Dual or quad-core Intel Atom® E3900 Series or Pentium™ N4200 or Celeron™ N3350 Processor SoC

  • Up to 8 GB DDR3L at 1867 MHz

  • Triple display support

  • HEVC H.265, Dual channel LVDS, HDMI/DP++, DP++, and 2x MIPI CSI camera (2/4 lanes)

  • 1x GbE with IEEE1588 (PTP) supported

  • 1x SATA 3.0, onboard eMMC

  • 4x PCIe x1

  • Windows 10 IoT Enterprise/Core and Yocto Linux supported

LEC-iMX6

SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor

  • Integrated 2D/3D graphics processors, 3D 1080p video processing, power management

  • Freescale SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad Core processor

  • Onboard DDR3L/1067 system memory from 512 MB to 2 GB

  • Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s

  • Extreme Rugged temperature range: -40°C to +85°C

LEC-BTS

SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip

  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)

  • HDMI and LVDS

  • GbE, camera interface

  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO

  • Extreme Rugged™ operating temperature: -40°C to +85°C

LEC-BW

SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)

  • Dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)

  • Up to 8 GB DDR3L at 1333/1600 MT/s

  • Single channel LVDS, HDMI/DP

  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe

  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC

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