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COM Express COM.0 Revizyon 3.1'in piyasaya sürülmesi, PCI Express Gen 4 ve USB 4 gibi geliÅŸmiÅŸ arabirimler için destek saÄŸlayarak, yaygın olarak benimsenen bu Modül Üzerinde Bilgisayar form faktörünü mevcut ve gelecekteki teknoloji trendleriyle uyumlu hale getiriyor. DiÄŸer arabirimler eklendi Genel Amaçlı SPI ve MIPI-CSI ve SoundWire seçeneklerini içerir.

Modeller

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Express-RLP Preliminary

COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor

  • COM Express Rev. 3.1

  • Additional Real time / Industrial SKUs (14C/20T)

  • Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC

  • AI inferencing (AVX-512 VNNI, Intel® Iris® Xe)

  • PCIe Gen4, 4x displays / 2x USB4

  • Extreme rugged operating temp

cExpress-TL

COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors

  • PCIe Gen4 and PCIe Gen3 lanes

  • AI inference (VNNI + Iris Xe graphics)

  • 2.5GbE Ethernet, with optional TSN

  • In-Band ECC error correction

Express-ADP

COM Express Rev. 3.1 Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor

  • COM Express Rev. 3.1

  • Up to 14 cores, 20 threads

  • Edge AI (VNNI, Intel® Iris® Xe)

  • DDR5 up to 4800 MT/s

  • 16 PCIe Gen4 lanes

cExpress-AR

COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)

  • Up to 8 cores based on AMD Zen 2 architecture

  • Improved graphics performance (new Radeon Vega GPU)

  • Up to 4x 4K displays (DP, eDP)

  • 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes

  • Configurable TDP down to 10W (8, 6 cores)

Express-TL

COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors

  • Intel® Tiger Lake-H Processors (up to 8 cores) integrated with Intel® UHD Graphics (Xe architecture)

  • AI inference (AVX512 VNNI + Intel® UHD GFX)

  • Up to 128GB DDR4 SO-DIMM, non-ECC, ECC

  • 3x DDI channels, 1x LVDS (opt. 4 lane eDP), opt. VGA, up to 4 independent displays

  • PCIe x16 Gen4, 2.5GbE (TSN, build option)

  • Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)

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cExpress-EL

COM Express Compact Size Type 6 Module with Intel Atom® x6000E Processor SoC (formerly codename: Elkhart Lake)

  • In-Band ECC error correction

  • 2.5GbE Ethernet, with optional TSN

  • PCIe Gen3 lanes, USB 3.2 10Gbps

  • 3x 4K display

  • Real Time I/O (GPIO, UART, I2C)

Express-CFR

COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors

  • PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors

  • Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation)

  • Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option)

  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)

  • Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)

cExpress-WL

COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors

  • 8th Gen quad/dual-core Intel® Core™ Processors

  • Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz

  • Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays

  • Up to eight PCIe lanes, GbE

  • Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

Express-CF/CFE

COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 series and Intel Xeon® Processors

  • PICMG COM.0 R3.0 Type 6 module with Hexacore i7/Xeon and Quadcore i3

  • Up to 48GB Dual Channel DDR4 at 2133/2400MHz

  • Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays

  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)

  • GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

cExpress-KL

COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)

  • 7th Generation Intel® Core™ and Celeron® Processors

  • Up to 32GB Dual Channel DDR4 at 1867/2133MHz

  • Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP

  • GbE, up to 6 PCIe x1 (build option)

  • Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option)

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Express-KL/KLE

COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors

  • 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors

  • Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz supports both ECC and non-ECC memory)

  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays

  • 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)

  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option for 25W TDP SKUs)

cExpress-AL

COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)

  • Intel Atom® E3900 series (formerly Apollo Lake) and Pentium®/Celeron® SOC, supporting full virtualization (VT-d/VT-x)

  • Supports IEEE 1588 Precision Time Protocol (PTP)

  • Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz

  • Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays

  • Up to five PCIe x1 Gen2 (by PCIe bridge IC, build option)

  • Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0 (build option)

  • Extreme Rugged operating temperature: -40°C to +85°C (build option for E3900 series SKUs)

Express-SL/SLE

COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)

  • 6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)

  • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz

  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays

  • 8 PCIe x1 and 1 PCIe x16

  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)

cExpress-SL

COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)

  • 6th Generation Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (codename: Skylake)

  • Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz

  • Two DDI channels, one LVDS (or 4 lanes eDP), support up to 3 independent displays

  • Up to 6 PCIe x1 (by build option, up to Gen3 dependent on SKU)

  • GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0

  • Supports Smart Embedded Management Agent (SEMA) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option)

  • cTDP support on specific skus

Express-BE END OF LIFE

COM Express® Basic Size Type 6 Module with AMD Embedded R-Series APU (formerly codename: Bald Eagle)

  • AMD Embedded R-Series APU with A77E Fusion Controller Hub

  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz

  • Three DDI ports and one LVDS port supporting 4 independent displays

  • Seven PCIe x1, one PCIe x16

  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0

  • Supports Smart Embedded Management Agent (SEMA®) functions

cExpress-BT

COM Express Compact Size Type 6 Module with Intel Atom® or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)

  • Single, dual, quad-core Intel Atom® E3800 series or Celeron® Processor SoC

  • Up to 8GB Dual Channel DDR3L at 1333MHz

  • VGA and two DDI channels (optional LVDS)

  • Three PCIe x1, GbE

  • Two SATA 3Gb/s, one USB 3.0, seven USB 2.0

  • Supports Smart Embedded Management Agent (SEMA®) functions

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