top of page
COMe.jpg
nanoX-EL_Module-1_.jpg

COM Express Tip 10 modülü, endüstriyel, medikal, ulaşım ve dış mekan uygulamaları için kontrolörler için el cihazları (akıllı pil) gibi düÅŸük güçlü platformlara (TDP 12W ve altı) yöneliktir. COM Express Type 10 Mini (84 x 55 mm, kredi kartı boyutu), mobil uygulamalar için grafikleri ve optimize edilmiÅŸ G/Ç sayısını desteklerken, ultra düÅŸük güç tüketimiyle giriÅŸ seviyesi iÅŸleme yeteneÄŸine sahiptir.

Modeller

nanoX-EL_Module-1_.jpg
nanoX-AL_F-web.jpg
nanoX-BT-F-web.jpg

nanoX-EL

COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors

  • LPDDR4 with in-band ECC error correction

  • TCC and 2.5GbE with optional TSN

  • PCIe Gen3 lanes, USB 3.2 10Gbps

  • Real-time I/O (GPIO, UART, I2C)

nanoX-AL

COM Express Mini Size Type 10 Module with Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly codename: Apollo Lake)

  • Intel Atom® E3900 Series, Pentium® and Celeron® SoC

  • Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz

  • Newest Intel® Gen9 Low Power graphics, Up to 4k resolution and H.265 codec

  • Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE

  • Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0 (build option)

  • Supports Smart Embedded Management Agent (SEMA®) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option for E3900 series SKUs)

nanoX-BT

COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)

  • Single, dual, quad-core Intel Atom or Celeron Processor System-on-Chip

  • Up to 4GB soldered Dual Channel DDR3L at 1333MHz

  • One DDI channel, one LVDS (optional eDP)

  • Three PCIe x1, GbE

  • GbE, two SATA 3Gb/s, four USB and one USB client

  • Supports Smart Embedded Management Agent (SEMA®) functions

  • Extreme Rugged operating temperature: -40°C to +85°C (build option)

bottom of page