Edge Computing için endüstriyel fansız yerleÅŸik PC'ler
GeniÅŸletilebilir fansız yerleÅŸik bilgisayarların Matrix serisi, uç yapay zeka ve uç bilgi iÅŸlem uygulamalarının yanıt hızını ve dayanıklılığını artırmak için tasarlanmıştır. Performans ve dayanıklılık için tasarlanan Matrix geniÅŸletilebilir fansız yerleÅŸik bilgisayarlar, uçta zamanında veri odaklı karar vermeyi mümkün kılmak için performans, geniÅŸletilebilirlik, kolay entegrasyon ve saÄŸlamlık sunar.
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Matrix geniÅŸletilebilir fansız yerleÅŸik bilgisayarlar, daha hızlı teÅŸhis için bilgi iÅŸlem yoÄŸun yüksek çözünürlüklü tıbbi görüntülemeyi hızlandırarak, kalite güvencesi için ürün kusurlarını tespit edip sınıflandırarak, güvenli eriÅŸim kontrolü için giriÅŸ noktalarında yüz tanıma uygulayarak, takip ederek endüstriler genelinde verimlilik, üretkenlik ve güvenlik geliÅŸtirmesi saÄŸlar. tehlike önleme ve kontrol için iÅŸçilerin hareketi ve daha fazlası.
Modeller
MXC-6600 Series
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor
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Dual SODIMMs for up to 32GB DDR4
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Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0
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2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0
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Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
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Flexible modular expansion with 2 or 4 slots
MXC-6400 Series
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
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6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset
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2x DDR4 SO-DIMM sockets support up to 32GB memory
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1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots
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2x Mini PCIe and 1x USIM slots
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Support for 3 independent displays with 2x DisplayPort and 1x DVI-I ports
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3x Intel® GbE LAN ports with teaming function, Intel® iAMT 11.0
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2x 2.5" hot-swappable SATA III (6.0 Gb/s) trays on the front panel and 2x internal SATA III (6Gb/s) ports with RAID 0/1/5/10 support
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Remote power on/off switch connector on the front panel
MVP-6200 Series
12/13th Generation Intel® Processor-Based Expandable Modular Industrial Computers
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12/13th generation Intel® Alder Lake-S socket type processor (LGA 1700)
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Microsoft® Windows® or Linux® Ubuntu operating system option
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Rugged design for 24/7 operation
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Wide-temp operation from -20°C~60°C
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Scalable with ADLINK AFM (Adaptive Function Module) slot, enabling fast application-specific access
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Flexible modular expansion support
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Front accessible I/O ports, wall mounting supported
MVP-6100-MXM Series
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
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9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor
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Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC
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Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
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2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0
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Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Front accessible I/O and adaptive Function Module 2.0 options
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Flexible functionality expansion: Expansion slots for standard PCIe and PCI card, Embedded slots for Mini PCIe, M.2 3042, 2x USIM
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World leading embedded GP/GPU computing options built-in
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Wide-temp operation from -20°C to 60°C
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Scalable with ADLINK AFM (Adaptive Function Module) slot, enabling fast application-specific access
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Front accessible I/O ports, wall mounting supported
MVP-6100 Series
Value Family 9th Generation Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Expandable Computer
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9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
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Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
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Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0
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2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0
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Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
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Front accessible I/O and adaptive Function Module v.2 option
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Flexible modular expansion with 2 or 4 slots
MVP-6010/6020 Series
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
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6th Gen Intel® Core™ i7/i5/i3 processors with H110/Q170 chipset
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Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory
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Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort
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MVP-6010: 1 PCIe Gen3 x16 and 3 PCI expansion slots
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MVP-6020: 2 PCIe Gen3 x8 and 2 PCI expansion slots
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3 Intel® GbE ports with teaming function
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2 software-programmable RS-232/422/485 + 2 RS-232 ports
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Extremely cost-effective, high performance Fanless system • Support up to 65W CPU with fanless operation
MVP-6000 Series
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
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6th Gen Intel® Core™ i7/i5/i3 processors and H110 chipset
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Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
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Support for two independent displays with 1 VGA, 1 DVI, and 2 DisplayPort
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1 PCIe Gen3 x16 and 1 PCI expansion slots
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3 Intel® GbE ports with teaming function
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2 software-programmable RS-232/422/485 + 2 RS-232 ports
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Front-accessible I/O for simplified installation and maintenance
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Extremely cost-effective, high performance fanless system
MXC-2300
Intel® Atom™ processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
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Intel® Atom™ processor E3845 with 4C @1.91 GHz SoC
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2x DDR3L SO-DIMM, supporting up to 8GB memory
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2 PCI + 1 PCIe x4 or 3 PCI expansion slots
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Built-in dual-port isolated CAN and 16-CH isolated DI and DO
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1 DisplayPort + 1 DVI-I
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2 Intel GbE ports with teaming function, 1 USB 3.0 + 4 USB 2.0 portsĆ
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2 software-programmable RS-232/422/485 + 2 RS-232 ports
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Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)